View BAS70W_283065.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Rev. 08 -- 4 May 2006 Product data sheet
1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview Package Philips 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY SOD323 SOD523 SOT23 SOD123F SOD882 SOT323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT143B SOT363 SOT666 SOT666 SOT363 JEITA SC-76 SC-79 SC-70 SC-70 SC-70 SC-70 SC-88 SC-88 single diode single diode single diode single diode single diode single diode dual series dual series dual common cathode dual common cathode dual common anode dual common anode dual isolated dual isolated dual isolated triple isolated quadruple; 2 series Configuration
Type number
1.2 Features
I High switching speed I High breakdown voltage I Low leakage current I Low capacitance
1.3 Applications
I Ultra high-speed switching I Voltage clamping
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
1.4 Quick reference data
Table 2. Symbol Per diode IF VF VR
[1]
Quick reference data Parameter forward current forward voltage reverse voltage IF = 1 mA
[1]
Conditions
Min -
Typ -
Max 70 410 70
Unit mA mV V
Pulse test: tp 300 s; 0.02.
2. Pinning information
Table 3. Pin 1 2 Pinning Description cathode anode
[1]
Simplified outline
Symbol
BAS70H; 1PS76SB70; 1PS79SB70
1 1
001aab540
2
sym001
2
BAS70L 1 2 cathode anode
[1]
1 1 2
2
sym001
Transparent top view
BAS70; BAS70W 1 2 3 anode not connected cathode
1 2
006aaa144
3 1
3 2 n.c.
006aaa436
BAS70-04; BAS70-04W 1 2 3 anode (diode 1) cathode (diode 2) cathode (diode 1), anode (diode 2)
1 2
006aaa144
3 1
3 2
006aaa437
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
2 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Pinning ...continued Description anode (diode 1) anode (diode 2) cathode (diode 1), cathode (diode 2)
1 2
006aaa144
Table 3. Pin 1 2 3
Simplified outline
Symbol
BAS70-05; BAS70-05W
3 1 3 2
006aaa438
BAS70-06; BAS70-06W 1 2 3 cathode (diode 1) cathode (diode 2) anode (diode 1), anode (diode 2)
1 2
006aaa144
3
1
3 2
006aaa439
BAS70-07 1 2 3 4 cathode (diode 1) cathode (diode 2) anode (diode 2) anode (diode 1)
1 2 1 2
006aaa434
4
3
4
3
BAS70-07S; BAS70-07V 1 2 3 4 5 6 BAS70VV 1 2 3 4 5 6 anode (diode 1) anode (diode 2) anode (diode 3) cathode (diode 3)
1 2 3
sym046
anode (diode 1) not connected cathode (diode 2) anode (diode 2) not connected cathode (diode 1)
1 1 2 3
001aab555
6
5
4
6
5
4
2
3
006aaa440
6
5
4
6
5
4
cathode (diode 2) cathode (diode 1)
1 2 3
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
3 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Pinning ...continued Description anode (diode 1) cathode (diode 2) anode (diode 3), cathode (diode 4) anode (diode 4) cathode (diode 3) cathode (diode 1), anode (diode 2)
1 2 3
006aaa256
Table 3. Pin BAS70XY 1 2 3 4 5 6
Simplified outline
Symbol
6
5
4
6
5
4
1
2
3
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 4. Ordering information Package Name 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY SC-76 SC-79 SC-70 SC-70 SC-70 SC-70 SC-88 SC-88 Description plastic surface-mounted package; 2 leads plastic surface-mounted package; 2 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 2 leads leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.5 mm plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 4 leads plastic surface-mounted package; 6 leads plastic surface-mounted package; 6 leads plastic surface-mounted package; 6 leads plastic surface-mounted package; 6 leads Version SOD323 SOD523 SOT23 SOD123F SOD882 SOT323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT143B SOT363 SOT666 SOT666 SOT363 Type number
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
4 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
4. Marking
Table 5. Marking codes Marking code[1] S2 G 73* AH S8 73* 74* 74* 75* Type number BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY Marking code[1] 75* 76* 76* 77* 77* 77 N1 70* Type number 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05
[1]
* = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode VR IF IFRM IFSM Tj Tamb Tstg
[1]
Parameter reverse voltage forward current repetitive peak forward current non-repetitive peak forward current junction temperature ambient temperature storage temperature
Conditions
Min -
Max 70 70 70 100 150 +150 +150
Unit V mA mA mA C C C
tp 1 s; 0.5 tp 10 ms
[1]
-65 -65
Tj = 25 C prior to surge.
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
5 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
6. Thermal characteristics
Table 7. Symbol Per device Rth(j-a) thermal resistance from junction to ambient SOT23 SOT143B SOT363 (BAS70-07S) SOT666 (BAS70VV) SOT666 (BAS70-07V) SOD123F SOD323 SOD523 SOD882 SOT323 Rth(j-sp) thermal resistance from junction to solder point SOT363 (BAS70XY)
[1] [2] [3]
[3] [2] [2] [2] [2] [2]
Thermal characteristics Parameter Conditions in free air
[1]
Min
Typ
Max
Unit
-
-
500 500 416 700 416 330 450 450 500 625
K/W K/W K/W K/W K/W K/W K/W K/W K/W K/W
-
-
260
K/W
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Reflow soldering is the only recommended soldering method. Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Per diode VF forward voltage IF = 1 mA IF = 10 mA IF = 15 mA IR Cd
[1]
[1]
Parameter
Conditions
Min
Typ
Max
Unit
-
-
410 750 1 100 10 2
mV mV V nA A pF
reverse current diode capacitance
Pulse test: tp 300 s; 0.02.
VR = 50 V VR = 70 V VR = 0 V; f = 1 MHz
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
6 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
102 IF (mA) 10
mra803
102 IR (A) 10
mra805
(1)
1 1 10-1 10-1
(1) (2) (3) (4)
(2)
10-2
(3)
10-2
0
0.2
0.4
0.6
0.8 VF (V)
1
10-3 0 20 40 60 VR (V) 80
(1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = -40 C
(1) Tamb = 125 C (2) Tamb = 85 C (3) Tamb = 25 C
Fig 1. Forward current as a function of forward voltage; typical values
103 rdif
()
Fig 2. Reverse current as a function of reverse voltage; typical values
mra804
mra802
2 Cd (pF) 1.5
102
1
10 0.5
1 10-1
1
10
IF (mA)
102
0 0 20 40 60 VR (V) 80
f = 10 kHz
Tamb = 25 C; f = 1 MHz
Fig 3. Differential forward resistance as a function of forward current; typical values
Fig 4. Diode capacitance as a function of reverse voltage; typical values
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
7 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
8. Package outline
1.35 1.15 1 0.45 0.15 1.1 0.8 0.85 0.75 1 0.65 0.58
2.7 2.3
1.8 1.6
1.65 1.25 1.55 1.15
2 0.40 0.25 Dimensions in mm 0.25 0.10 03-12-17 Dimensions in mm 0.34 0.26
2 0.17 0.11 02-12-13
Fig 5. Package outline SOD323 (SC-76)
Fig 6. Package outline SOD523 (SC-79)
1.7 1.5 1 1.2 1.0
3.0 2.8
3
1.1 0.9
0.45 0.15 2.5 1.4 2.1 1.2 3.6 3.4 2.7 2.5
0.55 0.35
1
2
1.9 Dimensions in mm
0.48 0.38
0.15 0.09 04-11-04 Dimensions in mm
2 0.70 0.55 0.25 0.10 04-11-29
Fig 7. Package outline SOT23 (TO-236AB)
Fig 8. Package outline SOD123F
0.62 0.55 2
0.50 0.46
2.2 1.8 3 0.45 0.15
1.1 0.8
0.30 0.22
0.65 0.30 0.22 0.55 0.47 Dimensions in mm
1.02 0.95
2.2 1.35 2.0 1.15
1
1 cathode marking on top side 1.3 03-04-17 Dimensions in mm
2 0.4 0.3 0.25 0.10 04-11-04
Fig 9. Package outline SOD882
BAS70_1PS7XSB70_SER_8
Fig 10. Package outline SOT323 (SC-70)
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
8 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
3.0 2.8 1.9 4 3 0.45 0.15
1.1 0.9 6
2.2 1.8 5 4 0.45 0.15
1.1 0.8
2.5 2.1
1.4 1.2
2.2 1.35 2.0 1.15
pin 1 index
1 0.88 0.78 1.7 Dimensions in mm
2 0.48 0.38 0.15 0.09
1 0.65 1.3 04-11-16 Dimensions in mm
2
3 0.3 0.2 0.25 0.10 04-11-08
Fig 11. Package outline SOT143B
1.7 1.5 6 5
Fig 12. Package outline SOT363 (SC-88)
0.6 0.5 4 0.3 0.1
1.7 1.5
1.3 1.1 pin 1 index
1 0.5 1 Dimensions in mm
2
3 0.27 0.17 0.18 0.08 04-11-08
Fig 13. Package outline SOT666
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
9 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
9. Packing information
Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package 1PS76SB70 1PS79SB70 BAS70 BAS70H BAS70L BAS70W BAS70-04 BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07S BAS70-07V BAS70VV BAS70XY SOD323 SOD523 SOT23 SOD882 SOT323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT143B SOT363 SOT666 SOT666 SOT363 Description 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 2 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2
[1] [2] [3]
[2] [3] [2] [3]
Packing quantity 3000 4000 8000 10000 -115 -115 -215 -115 -115 -215 -115 -215 -115 -215 -115 -215 -115 -125 -115 -125 -115 -115 -315 -315 -315 -135 -135 -235 -135 -315 -135 -235 -135 -235 -135 -235 -135 -235 -135 -165 -135 -165
SOD123F 4 mm pitch, 8 mm tape and reel
For further information and the availability of packing methods, see Section 13. T1: normal taping T2: reverse taping
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
10 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
10. Soldering
3.05 2.80 2.10 1.60
solder lands solder resist
1.65
0.95
0.50
0.60 occupied area solder paste
0.50 (2x)
msa433
Dimensions in mm
Fig 14. Reflow soldering footprint SOD323 (SC-76)
5.00 4.40 1.40 solder lands solder resist 2.75 1.20 occupied area
MSA415
preferred transport direction during soldering
Dimensions in mm
Fig 15. Wave soldering footprint SOD323 (SC-76)
2.15
solder paste solder lands solder resist occupied area
1.20
0.50 0.60
0.30 0.40 1.80 1.90
MGS343
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 16. Reflow soldering footprint SOD523 (SC-79)
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
11 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
2.90 2.50 solder lands solder resist 0.85 3.00 0.85 1.30 3 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30
MSA439
2
1 2.70 occupied area solder paste
Dimensions in mm
Fig 17. Reflow soldering footprint SOT23 (TO-236AB)
3.40 1.20 (2x) solder lands solder resist occupied area 2 4.60 4.00 1.20 3 1
preferred transport direction during soldering 2.80 4.50
MSA427
Dimensions in mm
Fig 18. Wave soldering footprint SOT23 (TO-236AB)
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
12 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2x)
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 19. Reflow soldering footprint SOD123F
1.30 R = 0.05 (8x) 0.30 R = 0.05 (8x)
solder lands solder resist occupied area solder paste
0.90
0.60 0.70 0.80 (2x) (2x) (2x)
0.30 (2x) 0.40 (2x) 0.50 (2x)
MBL872
Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 20. Reflow soldering footprint SOD882
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
13 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
2.65 0.75 1.325 1.30 solder lands 2 solder resist 0.60 2.35 0.85 (3x) 3 0.50 (3x) 1.90 1 0.55 (3x) occupied area solder paste
2.40
MSA429
Dimensions in mm
Fig 21. Reflow soldering footprint SOT323 (SC-70)
4.60 4.00 1.15 solder lands solder resist 2 occupied area 3.65 2.10 3 2.70 0.90 (2x)
1
MSA419
preferred transport direction during soldering
Dimensions in mm
Fig 22. Wave soldering footprint SOT323 (SC-70)
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
14 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
3.25 0.60 (3x) 0.50 (3x) solder lands 0.60 (4x) 4 2.70 1 2 3 1.30 3.00 occupied area solder paste solder resist
msa441
0.90 1.00 2.50
Dimensions in mm
Fig 23. Reflow soldering footprint SOT143B
4.45 1.20 (3x) solder lands solder resist occupied area
4
3
1.15 4.00 4.60
1
2 preferred transport direction during soldering
1.00 3.40
MSA422
Dimensions in mm
Fig 24. Wave soldering footprint SOT143B
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
15 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
2.65 0.60 (2x)
2.35
0.40 0.90 2.10 (2x) 0.50 (4x)
solder paste solder lands solder resist occupied area
0.50 (4x)
1.20 2.40
MSA432
Dimensions in mm
Fig 25. Reflow soldering footprint SOT363 (SC-88)
5.25
4.50
0.30 1.00 4.00
solder lands solder resist occupied area 1.15 3.75 transport direction during soldering
sot363
Dimensions in mm
Fig 26. Wave soldering footprint SOT363 (SC-88)
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
16 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
2.75 2.45 2.10 1.60 0.15 (4x) 0.40 (6x) 2.00 1.70 1.00 0.55 (2x) 0.30 (2x) 0.375 (4x)
1.20 2.20 2.50 solder lands placement area occupied area
0.075
solder resist
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 27. Reflow soldering footprint SOT666
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
17 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
11. Revision history
Table 10. Revision history Release date 20060504 Data sheet status Product data sheet Change notice Supersedes BAS70_1PS7XSB70_ SER_7 Document ID BAS70_1PS7XSB70_ SER_8 Modifications:
* * * * *
Type number BAS70XY added Table 9 "Packing methods": added packing method 2 mm pitch for SOD523 Figure 26 "Wave soldering footprint SOT363 (SC-88)": amended Figure 27 "Reflow soldering footprint SOT666": amended Section 12 "Legal information": updated Product data sheet 1PS76SB70_2 1PS79SB70_1 BAS70H_1 BAS70L_1 BAS70-07V_1 BAS70VV_1 BAS70W_3 BAS70-07S_4 BAS70_SERIES_6 1PS76SB70_1 BAS70W_2 BAS70_07S_3 BAS70_5
BAS70_1PS7XSB70_ SER_7
20050718
1PS76SB70_2 1PS79SB70_1 BAS70H_1 BAS70L_1 BAS70-07V_1 BAS70VV_1 BAS70W_3 BAS70-07S_4 BAS70_SERIES_6
20040126 19980716 20050425 20030520 20020117 20040910 19990326 20030411 20011011
Product specification Product specification Product data sheet Product specification Product specification Product data sheet Product specification Product specification Product specification
-
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
18 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
12. Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com.
12.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
12.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
BAS70_1PS7XSB70_SER_8
(c) Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 08 -- 4 May 2006
19 of 20
Philips Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information. . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 4 May 2006 Document identifier: BAS70_1PS7XSB70_SER_8

▲Up To Search▲

Price & Availability of BAS70W

	To Download BAS70W Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .